AlN hot plate
Basic Structure

Insulation Layer
Layer thickness |
10~20μm |
Dielectric voltage |
≧1000V/25μm |
Max. working temperature |
~ approx. 450℃ |
Heating element
Printed layer thickness |
10~20μm |
Volume resistivity value |
35~475μΩcm |
Max. working temperature |
~ approx. 600℃ |
Substrate
Material |
AlN (Aluminum Nitride) |
Thermal conductivity |
170W/m・K (RT) ~ |
Thermal expansion coefficient |
4.5×10-6/℃ |
Maximum manufactuable size |
φ450mm |
Features
- Energy saving
- Heating element electric resistance can be adjusted arbitrarily enabling design of heater output to match the application for low temperature to high temperature.
- Consistent thermal distribution
- Ceramic material characteristics and wide range temperature applicability.
- Design supporting your needs
- Proposals for appropriate design specifications matching customer requirements are possible
- Supports a broad range of elements
- Maximum use temperature is 450℃. Please contact us to investigate higher temperature levels.
