Electrostatic Chuck
In semiconductor production vacuum processes, electrostatic chucks are used to secure, carry and correct components such as wafers.
Our company’s Johnsen-Rahbek electrostatic chucks are highly regarded for our original material technology and machining technology.
Features
- Excellent chucking/de-chucking response
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By optimizing material structure, the chuck demonstrates extremely excellent chucking/de-chucking response.
This contributes to vast improvements in throughput. - Excellent flatness
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Our original polishing technology gives a highly precise flatness across whole surfaces.
Additionally, since we can achieve a great surface roughness, it is possible to reduce the particle and to increase the cuncking force. - High durability
- Since dielectric, internal electrode and insulator are sintered as a single unit, it features excellent stability over extended times compared to electrostatic chucks bonded with an adhesive.
Material Properties
| Materials | TiO2-doped Al2O3 Ceramic | |
|---|---|---|
| Bulk Density | g/cm3 | 3.98 |
| Young's Modulus | GPa | 400 |
| Poisson's Ratio | - | 0.24 |
| Fracture Toughness | MPa・m1/2 | 4.6 |
| Hardness | 98N, GPa | 14 |
| Dielectric Constant (1MHz) | - | 10.7 |
* The data indicated herein is representative values and not guaranteed values.
Product data (reference value)
- ・Applied Voltage：+300V / -300V
- ・Chucking/De-chucking response time: < 3 seconds
- ・Chucking Force: 706 N (φ 300 mm, 0.75% pin surface)
* The data indicated herein is representative values and not guaranteed values.
