Probe card micro hole machining product
Left: Macerite HSP, Middle: Macerite BT, Right: Macerite PN
These machinable ceramics for micro hole machining, our Macerite series is machined using a custom ultra-hard drill with highly precise hole diameter and hole positioning. This material supports the latest in micro-technology in important components for semiconductor/liquid crystal production equipment and inspection equipment.
Major applications
- Probe card insulation components,
- Wafer inspection equipment components,
- FPC inspection equipment components,
- FPD inspection equipment components, etc.
Supported materials
- Macerite HSP,
- Macerite BT,
- Macerite PN
Micro hole machining (standard)
Hole diameter | 50μm dia. |
---|---|
Hole diameter tolerance | ±5μm |
Hole position tolerance | ±5μm |
Macerite PN micro hole machining
Hole diameter: 50μm dia. Hole pitch: 80μm
Material characteristics
Name | Macerite HSP | Macerite BT | Macerite PN | |
---|---|---|---|---|
Composition | Fluorphlogopite | Boron nitride+α | ||
Color | ivory | brown | grey | |
Bulk Density | g/cm3 | 2.67 | 2.47 | 3.1 |
Water Adsorption Ratio | % | 0 | 0 | 0 |
Flexural Strength | MPa | 160 | 150 | 290 |
Young's Modulus | GPa | 65 | 73 | 120 |
Hardness | GPa | 2.2 | - | 1.7 |
Electrical Resistivity | Ω・cm [RT] | > 1015 | > 1014 | > 1014 |
Dielectric Constant | (1MHz) | 6.5 | 7.2 | 7 |
Dielectric Strength | kV/mm | 10 | > 10 | > 10 |
Thermal Expansion Coefficient | X10-6/℃ (RT-200℃) | 9.8 | 4.5 | 4.2 |
Thermal Shock Resistance | ⊿T (℃) | 175 | - | 650 |
* The data indicated herein is representative values and not guaranteed values.